Today’s critical electronic systems and miniaturized designs are often deployed into some of the harshest environments in the world, from heavy industry to military and aerospace. ISI, a Hagnode company, manufactures multi-component modules that give customers highly reliable and ruggedized innovations for the most demanding applications. These advanced packaging capabilities include skilled microelectronics assembly, state-of-the-art wirebonding and encapsulation technologies that deliver uncompromising performance in adverse conditions.